Precision BTB · Micro RF · FPC · Spring contacts | Full 0.175mm to 0.8mm pitch BTB cluster

Industry insights

Cost advantages of mold-first, plate-later on fine-pitch connectors

2026-07-15
Cost advantages of mold-first, plate-later on fine-pitch connectors

How precious metal usage, tooling investment and automated assembly shape the cost structure of a process choice.

The cost of a fine-pitch connector rarely sits in the plastic or the copper. It sits in two places: precious metal consumption, and the tooling and automation built around plating and assembly.

The conventional route plates the entire strip before molding, so precious metal also covers areas that are later punched away. Molding first and plating afterwards lets us plate only the contact area, putting gold exactly where wear resistance and low contact resistance are needed.

What is saved is not only gold. Localized plating eliminates a high-precision plating mold and reduces the automated fixtures built around plating-then-assembly; on very fine terminals such as 0.175mm pitch, yield and cost both benefit.

The trade-off is tighter molding accuracy upstream: flash and burrs on the plastic part directly affect the plating boundary. That is why insert-molding and tooling sit in the same in-house loop.