APPLICATION
Camera Module Connector
Camera module miniaturisation always ends at the connector: board-to-board carries the high-density signals to the main board, FPC handles the flexible routing. CPT supplies both.
Three ways to connect a module
1) 0.35mm BTB: B09, 6–60 pins at 0.6mm stack, the default for phone and wearable camera modules, directly compatible with BK13C06. 2) 0.4mm BTB: B118, 10–100 pins with six stack heights from 1.5 to 4.0mm, for multi-camera and high-resolution designs. 3) 0.3mm FPC: down to 0.9mm height for flexible or cross-structure routing.
What module designers care about
Space: a 0.6mm stack on B09 or a 0.9mm FPC height decides whether the module fits the mid-frame. Signal integrity: high-resolution MIPI lanes are sensitive to impedance and crosstalk, so place ground beside the connector and keep fan-out short. Reliability: modules see drop and thermal cycling tests, making gold thickness and retention the two key numbers.
Automotive and security modules differ
Automotive cameras prioritise wide temperature and vibration, typically using 0.4mm / 0.5mm B118 or B104 with spring contacts for chassis grounding. Security and machine vision prioritise mating cycles and latch reliability, where flip-lock FPC dominates.
Specifications
| Type | Series | Specification | Best for |
|---|---|---|---|
| 0.35mm BTB | B09 (BB0009) | 6–60 pins, 0.6mm stack | Phone and wearable cameras |
| 0.40mm BTB | B118 (BB0118) | 10–100 pins, 1.5–4.0mm | Multi-camera, high resolution, automotive |
| 0.50mm BTB | B104 | 10–80 pins, 3.0–5.0mm | Automotive, security, industrial |
| 0.30mm FPC | P03 series | 0.9 / 1.0mm height | Flexible or cross-structure routing |
| 0.50mm FPC | P05 series | 1.0–4.5mm height | Module to main board |
FAQ
Which connector is typical for camera modules?
0.35mm BTB (B09) for phones and wearables, 0.4mm (B118) for multi-camera and high resolution, 0.3mm FPC where flexing is required.
Which original part numbers can be cross-referenced?
B09 maps to BK13C06, B118 to DF40 / DF40C and B104 to DF12; all are searchable in the cross-reference table.
What should be validated for drop tests?
Retention force and contact resistance drift; run 30–50 mating cycles before drop and thermal cycling.
Sample and MOQ?
Samples in 3–7 days; volume production scheduled by part number and packaging, tape and reel for SMT.
Send us your stack-up requirement
Share board thickness, available height, channel count and environment and we will recommend and quote within 24 hours.